2022
- Developed miniaturized Mini Molding products (160808)
- Cooperated with Kingston for DDR5
Company History
Company History
2021
- Cooperated with brand customer - QCT
- Expand O-RAN structure and become a member of the alliance
2020
- Implementing the SAP system
- In process of obtaining AEO Certificate
- Taipei Factory: High-end product line launched officially
2019
- Established Zhongshan plant. To fulfill Industry 4.0 trend requirement, and to build the smart production factory
- Cooperation with EMS company - Pegatron & Luxshare
- 5G, AIoT and mobile phone charging peripheral market expansion
- Cooperated with panel companies, become the strategic partner with Innolux, SDP & SIO
2018
- Strategic cooperation with Bluetooth Audio IC design house to optimize the performance of whole system
- Products approved by Facebook
2017
- Technical Cooperation - Develop ZTFL Miniature High Current Product
- Products approved by AWS
2016
- East China market expansion - Established Suzhou office
- Cooperated with Wistron and Liteon
2015
- Established ZenithTek Guangzhou in Nansha, Guangzhou
- Japanese market expansion - Cooperated with Toshiba
2014
- Completed the product development that fits server requirement
- Server and Networking market expansion
- Customized inductor capability for gaming graphics card
2013
- Cooperated with Foxconn and Acer
2012
- Implemented automatic production line and automation equipment
- Developed miniaturized products (252012, 201610)
- Cooperated with Compal
2011
- Strategic cooperation with upstream IC design house: Broadcom, Qualcomm, Mediatek, Realtek, SMI, etc.
- Cooperated with Storage customer - Kingston, Phison & Synology
- Korean market expansion - Cooperated with SK Hynix
- Expand Chinese market and assign our first Chinese agent “R.I. Season Shenzhen Technology Co. LTD”
2010
- Established ZenithTek Inc. at Tucheng, New Taipei City
- Cooperated with IPC customer - Weintek and AAEON